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august 2007 rev 1 1/12 12 buld742c high voltage fast-switching npn power transistor features low spread of dynamic parameters high voltage capability minimum lot-to-lot spread for reliable operation very high switching speed applications electronic ballast fo r fluorescent lighting switch mode power supplies description the device is manufactured using high voltage multi-epitaxial planar technology for high switching speeds and hi gh voltage capability. thanks to an increased in termediate layer, it has an intrinsic ruggedness which enables the transistor to withstand an high collector current level during breakdown co ndition, without using the transil protection usually necessary in typical converters for lamp ballast. figure 1. internal schematic diagram dpak 1 3 table 1. device summary order code marking package packaging BULD742CT4 buld742c dpak tape & reel www.st.com
contents buld742c 2/12 contents 1 electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3 test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 5 packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 6 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
buld742c electrical ratings 3/12 1 electrical ratings table 2. absolute maximum rating symbol parameter value unit v ces collector-emitter voltage (v be = 0) 1050 v v ceo collector-emitter voltage (i b = 0) 400 v v ebo emitter-base voltage (i c = 0, i b = 2 a, t p < 10 ms) v (br)ebo v i c collector current 4 a i cm collector peak current (t p < 5ms) 8 a i b base current 2 a i bm base peak current (t p < 5ms) 4 a p tot total dissipation at t c = 25c 45 w t stg storage temperature -65 to 150 c t j max. operating junction temperature 150 c table 3. thermal data symbol parameter value unit r thj-case thermal resistance junction - case 2.78 c/w r thj-amb thermal resistance junction - ambient 73 c/w
electrical characteristics buld742c 4/12 2 electrical characteristics (t case = 25c unless otherwise specified) table 4. electrical characteristics symbol parameter test conditions min. typ. max. unit i ces collector cut-off current (v be = 0) v ce =1050 v 0.2 10 a i ceo collector cut-off current (i b = 0) v ce =400 v 10 250 a v (br)ebo emitter base breakdown voltage (i c = 0) i e = 1 ma 15 19 24 v v ceo(sus) (1) 1. pulsed duration = 300 ms, duty cycle 1.5% collector-emitter sustaining voltage (i b = 0) i c =10 ma 400 450 v v ce(sat) (1) collector-emitter saturation voltage i c = 1 a _ i b = 0.2 a i c = 3.5 a _ _ i b = 1 a 0.15 0.6 0.5 1.5 v v v be(sat) (1) base-emitter saturation voltage i c = 3.5 a i b = 1 a 1.1 1.5 v h fe (1) dc current gain i c = 0.1 a _ v ce = 5 v i c = 0.8 a _ _ v ce = 3 v 48 25 75 35 100 50 t s t f resistive load storage time fall time i c = 2 a v cc = 125 v i b1 = -i b2 = 400 ma t p = 300 s v be(off) = -5 v 2.4 350 3.5 500 s ns e ar repetitive avalanche energy l = 2 mh c = 1.8 nf v be(off) = -5 v 6mj
buld742c electrical characteristics 5/12 2.1 electrical characteristics (curves) figure 2. safe operating area figure 3. derating curve figure 4. output characteristics figure 5. dc current gain figure 6. dc current gain figure 7. collector - emitter saturation voltage
electrical characteristics buld742c 6/12 figure 8. base-emitter saturation voltage figure 9. resistive load switching on times (h fe = 5) figure 10. resistive load switching off times (h fe = 5) figure 11. resistive load switching on times (h fe = 10) figure 12. resistive load switching off times (h fe = 10) figure 13. reverse biased soa
buld742c test circuit 7/12 3 test circuit figure 14. energy rating test circuit figure 15. resistive load switching test circuit
package mechanical data buld742c 8/12 4 package mechanical data in order to meet environmental requirements, st offers these devices in ecopack? packages. these packages have a lead-free second level interconnect. the category of second level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at: www.st.com
buld742c package mechanical data 9/12 dim. mm. inch min. typ max. min. typ. max. a 2.2 2.4 0.086 0.094 a1 0.9 1.1 0.035 0.043 a2 0.03 0.23 0.001 0.009 b 0.64 0.9 0.025 0.035 b4 5.2 5.4 0.204 0.212 c 0.45 0.6 0.017 0.023 c2 0.48 0.6 0.019 0.023 d 6 6.2 0.236 0.244 d1 5.1 0.200 e 6.4 6.6 0.252 0.260 e1 4.7 0.185 e 2.28 0.090 e1 4.4 4.6 0.173 0.181 h 9.35 10.1 0.368 0.397 l 1 0.039 (l1) 2.8 0.110 l2 0.8 0.031 l4 0.6 1 0.023 0.039 r 0.2 0.008 v2 0 8 0 8 dpak mechanical data 0068772-f
packaging mechanical data buld742c 10/12 5 packaging mechanical data tape and reel shipment dpak footprint dim. mm inch min. max. min. max. a 330 12.992 b 1.5 0.059 c 12.8 13.2 0.504 0.520 d 20.2 0.795 g 16.4 18.4 0.645 0.724 n 50 1.968 t 22.4 0.881 base qty bulk qty 2500 2500 reel mechanical data dim. mm inch min. max. min. max. a0 6.8 7 0.267 0.275 b0 10.4 10.6 0.409 0.417 b1 12.1 0.476 d 1.5 1.6 0.059 0.063 d1 1.5 0.059 e 1.65 1.85 0.065 0.073 f 7.4 7.6 0.291 0.299 k0 2.55 2.75 0.100 0.108 p0 3.9 4.1 0.153 0.161 p1 7.9 8.1 0.311 0.319 p2 1.9 2.1 0.075 0.082 r 40 1.574 w 15.7 16.3 0.618 0.641 tape mechanical data all dimensions are in millimeters
buld742c revision history 11/12 6 revision history table 5. document revision history date revision changes 09-aug-2007 1 first release.
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